Pad清洗系統 Pad Cleaning System

•1.在OLB過程前提供更大量的bonding與防止受到異物汙染的短路情況.
•2.清洗在TFT pad頂部與底部側邊的有機汙染物.
•1. cleaning pad before OLB process for higher quality of the bonding and preventing short-circuit by the contamination of the foreign materials.
•2. main purpose of the equipment :  cleaning the organic contaminations on the top and bottom side of TFT pad area